China's grinding wheel (KINIK) (1560) quickly responded to market demand and re-launched the new Eletroplated Diamond Wire patent technology at SEMICON International Semiconductor Show 2012, which will more effectively solve the most critical material high-hardness sapphire substrate upstream of LED ( Sapphire) is a slicing problem and is expected to meet more than half of the demand in the Taiwanese market in 2013. The sapphire substrate (Sapphire) is still the most critical material for upstream LED use. With the increasing demand for high-power LEDs, the demand for sapphire substrates is gradually converted to large size. The sapphire substrate is due to the high hardness characteristics of its materials. In the current slicing process, the Eletroplated Diamond Wire is used for multi-wire wire sawing. According to statistics, the current demand for electroplated diamond wire in Taiwan's sapphire slicing industry is always The amount is about 5,000km. Multi-wire wire saw cutting is a processing method for cutting semiconductors, crystals, various single crystals, magnetic materials, precision ceramics, and other hard and brittle materials. Free abrasive wire saws are currently widely used in semiconductor and solar tantalum wafer slicing processes, which use steel wire to drive free abrasive (abrasive + liquid) to remove material, but due to abrasive waste after free abrasive wire saw use, There are environmental protection problems that need to be recycled, and the processing efficiency is low, so the development of fixed abrasive wire saws has become an inevitable trend in the industry. China Grinding Wheels publishes the latest patented electroplated diamond line technology, which is used to coat the middle layer on the core line and uniformly embed the abrasive material, which can effectively avoid the problem of abrasive accumulation in general electroplating deposition; subsequent plating of metal protective layer to cover and fix Abrasive material can hold the abrasive more stably, which increases the service life and processing efficiency of the wire saw. At the same time, the metal protective layer on the abrasive surface can play a buffer and protect the surface to improve the quality of the cutting surface. China Grinding Wheel not only masters the core technology of grinding, but also successfully applied the precision grinding technology to the semiconductor wafer recycling process. The Zhongsha, which has achieved great success, was also awarded the TSMC “free inspection and storage†award. In 2011, it won the Taiwan Top 100 brand TOP 100. Honor. The latest patented electroplated diamond line technology is bound to once again benefit the market and stimulate production capacity.
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