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In recent years, due to its unique orientation structure and excellent thermal conductivity, carbon nanotube arrays have become hot spots for thermal interface packaging materials. In the electronic packaging process, diversification of the semiconductor substrate causes incompatibility between the catalyst and the growth substrate, and an excessively high growth temperature (>500° C.) causes the package substrate to overheat and fail, making it impossible to directly use the package substrate to grow the carbon nanotube array. Therefore, the complete transfer of a well-grown carbon nanotube array to a specific application substrate is the key to the application of the carbon nanotube array to a thermal interface material.
The existing methods for transferring the carbon nanotube array are roughly divided into two types. One is physical peeling, that is, using a bonding agent such as a polymer, solder, and thermal conductive silver paste to transfer the carbon nanotube array from the growth substrate; One is chemical stripping: the silicon dioxide layer on the growth substrate is etched away or water is used to etch the carbon nanotube root to peel off the carbon nanotube array from the substrate. All of these methods have the disadvantages of serious damage to the array structure of carbon nanotubes, small transfer area, and complicated process during the transfer process.
Under the strong support of the National Natural Science Foundation of China and the Chinese Academy of Sciences, Yao Yagang and Li Qingwen, research fellows of the Suzhou Nanotechnology and Nanobionics Institute of the Chinese Academy of Sciences, and Xuan Yimin, a professor at the Nanjing University of Science and Technology, conducted systematic and in-depth research on this subject. Research has made breakthroughs in the large-area non-destructive rapid transfer of carbon nanotube arrays.
They use the thermal oxidation assisted method to transfer the carbon nanotube arrays. After a certain period of thermal oxidation, the carbon nanotube array can be completely peeled from the substrate without any damage and become an independent self-supporting film. Any adhesive can be used, single and double-sided transfer to a specific application substrate. Raman and TGA test results show that in the weak oxidation process, the quality of the carbon nanotube array is not significantly reduced, ensuring its good thermal conductivity.
The researchers further plasma-etched (RIE) the upper and lower surfaces of the carbon nanotube array independent film, then coated the metal nano-surface layer with electron beam evaporation to prepare a flexible compressible thermal interface material with a sandwich structure, its mechanical properties, heat conduction The performance and thermal resistance of the interface are better than those of the original carbon nanotube array and have potential application prospects in the field of thermal interface materials for electronic packaging. The relevant results were published in J. Am. Chem. Soc. 2014, 136, 18156−18162; ACS Appl. Mater. Interfaces. 2014, 6, 539−544; J. Nanosci. Nanotechnol. 2015, 15, 3212-3217.
This work has received substantial funding from the National Natural Science Foundation of China, the Chinese Academy of Sciences, and the Suzhou Nanometer Institute project, and has received technical support from the composite material testing and processing platform of the Suzhou Advanced Materials Division of the Suzhou Nanometer Institute.
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